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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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High TG Fr4 UL 94v-0 Rohs Rogers Ro 4350B PCB RFID With Microwave

Shenzhen Xinchenger Electronic Co.,Ltd
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High TG Fr4 UL 94v-0 Rohs Rogers Ro 4350B PCB RFID With Microwave

Brand Name : XCE

Model Number : XCE BG2

Certification : CE,ROHS,FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : MOQ 1 Piece

Price : Negotiation

Payment Terms : T/T, Western Union

Supply Ability : 1000000 pieces per week

Delivery Time : 5-10 working days

Packaging Details : 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package

Color : Green

Material : Rogers Material

Layer : 4 layer

Board Size : 12*12cm

Copper Thinknes : 1 oz

Min Line Width : 5 mil

Min Line Space : 5 mil

Surface Finish : Gold Plating

Name : Rogers 4350B pcb

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High TG Fr4 UL 94v-0 Rohs Rogers Ro 4350B PCB RFID With Microwave

Quick Detail :

1. Type : Pcb

2. Material : Rogers

3. Layer : 4

4. Products Size : 12*12cm

5. Permittivity : 3

6. Surface finish : Gold Plating

Features:

1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .

2. Immersion gold surface finish make the pcb 's conductive performance enhancements.

3. Multilayer pcb design ,the precision of the pcb improves much more better .

4. Low dielectric : 3 dielectric conductivity much more precision .

Description :

RO4350B™ materials are proprietary woven glass reinforced hydrocarbon/ceramics with electrical performance close to PTFE/woven glass and the manufacturability of epoxy/ glass.

Providing tight control on dielectric constant and low loss while utilizing the same processing method as standard epoxy/glass, RO4350B is available at a fraction of the cost of conventional microwave laminates. No special through-hole treatments or handling procedures are required as with PTFE based microwave materials.

RO4350B materials are UL 94V-0 rated for active devices and high power RF designs.

Typical Applications

  • Cellular Base Station Antennas and Power Amplifiers
  • Microwave point to point (P2P) links
  • Automotive Radar and Sensors
  • RF Identification (RFID) Tags
  • LNB’s for Direct Broadcast Satellites

Production Description :

XCE PCB technical specifications
Annual stock Material Rogers,Taconic,Arton,Isola,F4B,TP-2.FR-4,High TG,Halogen free
Layer No. 1~16
Min board thickness

2 layer0.2mm

4 layer0.4mm

6 layer 0.6mm

8 layer 0.8mm

10 layer 1.0mm

Max panel size 508*610mm
Board thickness tolerance T0.8mm±8%.,T<0.8mm±5%
Wall hole copper thickness >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp 0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 28820Sec
Testing voltage 50-300V
Min buried blind via 0.2mm(8mil)
Outer copper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickless 0.075mm-5mm
Taphole aperture 0.2mm-0.6mm
Special technology Indepedance,Blind buried via,thick gold,aluminum PCB
Surface finish HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating

Competitive Advantage:

1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .

What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.


Product Tags:

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